SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...
This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...
Western Digital has announced a new memory stick as part of its SanDisk brand that can expand the storage of an iPhone 15 or 15 Pro now that Apple has embraced USB-C. The new version of the ...
Running out of internal storage is an issue I face regularly with my iPhone, but a new drive from SanDisk can free up ... without figuring how or where to stick the drive while recording.