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Semiconductor Engineering
12 天
Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced ...
High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.
Design-Reuse
8 年
Faraday Reduces Packaging Design Time by 60 Percent Using Cadence OrbitIO Interconnect ...
04 May 2016 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Faraday Technology Corporation, a leading fabless ASIC/SoC and IP provider, used Cadence® OrbitIO™ interconnect designer ...
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