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EDN
7 小时
The SoC design: What’s next for NoCs?
With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.
EDN
1 天
TCXO enhances synchronization for 800G networks
The SiT5977 Super-TCXO from SiTime is a single-chip timing device that achieves 3X better synchronization than its predecessor.
EDN
1 天
Calories, power dissipation, and environmental chambers
John Dunn’s observation on the relationship between calories, body's heat dissipation, and how this can impact an ...
EDN
1 天
A closer look at LLM’s hyper growth and AI parameter explosion
The rapid evolution of artificial intelligence (AI) has been marked by the rise of large language models (LLMs) with ...
EDN
2 天
A beginner’s guide to power of IQ data and beauty of negative frequencies – Part 2
Part 2 of this DI series presents a device that allows you to play with and display live SDR signal spectrums with negative ...
EDN
2 天
Microvolts to kilovolts in milliseconds with one I/O pin
You can use the LMC555 and an RC network go from 0.01 V to 1000 V using one I/O pin, you just have to find a resistor rated ...
EDN
2 天
The rise of MCU-enabled sensor designs
Here is how MCUs are setting in motion a transformation in sensor designs serving consumer, industrial, and IoT applications.
EDN
3 天
Multi-solar panel interconnections: Mind the electrons’ directions
Solar panels can simplistically be thought of as batteries. But batteries can also be the solar panels’ undoing. Confused? Read on!
EDN
4 天
Nvidia, TSMC, and advanced packaging realignment in 2025
Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
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