High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Discover the top beauty packaging design trends for this year, as picked by Patrick Llewellyn, VP Digital and Design Services ...

The packaging design and simulation technology industry is evolving rapidly, driven by advancements in software tools that ...

04 May 2016 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Faraday Technology Corporation, a leading fabless ASIC/SoC and IP provider, used Cadence® OrbitIO™ interconnect designer ...