X-FAB to Provide Foundry Services for Akustica's Family of CMOS MEMS Silicon Microphone Chips ERFURT, GERMANY and PITTSBURGH, PA -- May 31, 2006 -- Akustica, Inc., a pioneer in acoustic system-on-chip ...

Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=16 ...

This latest move marks CATL's third known investment in an IC design startup, reinforcing its growing focus on semiconductor technology. CATL powers into chip market: strategic bets on IC design ...

A single-chip UHF RFID reader transceiver IC has been implemented in 0.18 μm SiGe BiCMOS technology. The chip includes all transceiver blocks as RX/TX RF front-end, RX/TX analog baseband, frequency ...

例子主要包括用于补偿压力变化的电机旋转。 微机电芯片 MEMS IC 制造可以使用硅来完成，从而将少量材料层放置在硅基板上，否则固定在硅基板上。之后，有选择地固定下来，留下隔膜、横梁、杠杆、弹簧和齿轮等微观 3D 结构。 MEMS 制造需要许多用于构建其他 ...

Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination ...

SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a leading developer and provider of Semiconductors, PKI, and Post-Quantum technology hardware and software solutions, today announced that it has ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...