nor how many wafers the machines can produce per hour. More importantly, the MIIT document did not provide details of their capabilities for feature alignment, which could indicate how advanced ...

stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and ...

to fully automated wafer handling, such as automatic pre-alignment and fine alignment in the MicroProf ® AP. Overlay, which ...