Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...

One of the most complex parts of this process is lithography: the step in which shapes are drawn onto a silicon wafer. There are several ways to do this, all of them rather complicated ...

Nanostencil lithography (NSL) is a shadow-mask-based nanopatterning technique that allows for the direct deposition of materials through a stencil mask with nanoscale openings. It enables the ...