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Tom's Hardware on MSNIntel has processed 30,000 wafers with High-NA EUV chipmaking toolIntel installed and started using two High-NA EUV lithography tools from ASML at its D1 development fab near Hillsboro, Oregon, last year and has now processed as many as 30,000 w ...
The Register on MSN22d
Talk of Broadcom and TSMC grabbing pieces of Intel lights fire under investorsReports earlier this week involved Broadcom, which gobbled up VMware just over a year ago. As such, CEO Hock Tan is understood to be eyeing up Intel's chip design and marketing businesses with a view ...
Intel announced that its new ASML lithography machines are now in production, after a 7-year delay, to produce smaller and faster chips by 2024.
In a blistering critique, former Intel CEO and Chairman Craig Barrett has strongly opposed breaking the company into separate ...
During the last quarter, Intel kept up a steady pace with the manufacture of 30,000 wafers.ts most recent high-NA EUV machines nearly match the performance of earlier EUV systems, yet they deliver ...
The move was a shift in strategy for Intel, which lagged rivals in adopting the previous generation of extreme ultraviolet (EUV) lithography machines. It took Intel seven years to put those ...
These will likely need ASML's latest EUV tools called high numerical aperture (high NA) EUV. Intel is the only foundry that has one of these tools up and running and performing high NA R&D.
By way of example, TSMC's N3E node as used in the latest Apple chips has gate pitch of at minimum 45 nm and a metal pitch of ...
Intel's 18A process node is ready for customer projects, promising 15% better performance per watt and 30% better chip density than Intel 3. Intel's Xeon 6 processors have been adopted by major ...
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