Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...
Current EUV pellicles struggle to withstand the extreme conditions of high-power EUV scanners, leading to performance issues. The potential of carbon nanotubes: CNT-based EUV pellicles offer ...
This is because all matter, including air, absorbs EUV radiation. For scanner manufacturers, this has two major consequences. First, it means that all the optical elements responsible for the ...
Russia has unveiled a roadmap to develop its own lithography machines, aiming to create less costly and complex equipment than ASML's systems, according to CNews. These machines will use lasers ...